Crystallographic Orientation (Miscut): +/-3°
Crystallography: Typically 100% single sector {100}
Edges: Laser Cut
Edge Features: < 0.2 mm
Laser Kerf: <5°
Edge Orientation: <110> edges
Face Orientation: {100} faces
Side 1, Roughness, Ra: polished, Ra < 5 nm on {100) face
Side 2, Roughness, Ra: polished, Ra < 5 nm on {100) face
Charge Collection Efficiency (CCE): Typically >95%
Charge Collection Distance (CCD): Typically >475µm, @0.5 V µm-1 applied field, for 500 µm plate
Lateral Tolerance: +0.2/-0 mm
Thickness Tolerance: +/- 0.05 mm
Boron Concentration [B]: <50 ppb
Nitrogen Concentration [N]: <50 ppb